AP6181-EVB EVB board

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Product Overview

EVB board only, wifi Sip module can be purchased at http://www.mfactors.com/ap6181-802-11b-g-n-wifi-sip-module-1t1r/

Overview:

  • Chipset : Broadcom
  • Form Factor: Stamp Type
  • Interface: SDIO 2.0
  • Antenna: External
  • Support: Linux , Android

AP6181 is a 802.11b/g/n 1T1R low-cost and low-power consumption module which has all of the WiFi functionalities. The highly integrated module makes the possibilities of web browsing, VoIP, headsets and other applications. With seamless roaming capabilities and advanced security, also could interact with different vendors’ 802.11b/g/n Access Points in the wireless LAN.

This wireless module complies with IEEE 802.11 b/g/n standard and it can achieve up to a speed of 72.2Mbps with single stream in 802.11n draft, 54Mbps as specified in IEEE 802.11g, or 11Mbps for IEEE 802.11b to connect to the wireless LAN. The integrated module provides SDIO interface for Wi-Fi.

This compact module is a total solution for Wi-Fi technologies. The module is specifically developed for Tablet, Smart phones and Portable devices.

 

Standard

IEEE 802.11 b/g/n 1T1R Wi-Fi Module

Interface

WiFi Interface

SDIO 2.0

Chipset

Broadcom

Radio

Antenna

External

Operating Frequency

 2.412 GHz ~ 2.4835 GHz (2.4 GHz ISM Band)

Modulation

802.11b : DQPSKDBPSKCCK

802.11 g/n : OFDM /64-QAM16-QAMQPSKBPSK

Form Factor

Stamp Type

Environmental

Temperature Range

-30°C ~ 65°C (Operating) ; -40°C ~ 85°C (Storage)

Humidity

(Non-Condensing)

Operating Humidity 10% to 95% Non-Condensing

Storage Humidity 5% to 95% Non-Condensing

Physical Specification

Dimensions

L x W x H: 12 x 12 x 1.4 (typical) mm

Software

Driver

Linux, Android

 

Note: Optimal RF performance specified in the data sheet, however, is guaranteed only -10°C to 55°C.

 

Block Diagram



Dimention

Document
File Name Type Updated Download
AP6181_datasheet ver1.1 2019.08.22