AP6256-EVB EVB board

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AP6256-EVB EVB board

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Product Overview

AP6256-EVB EVB board only, wifi Sip module is available at https://mfactors.com/ap6256-802-11ac-a-b-g-n-wifi-bluetooth5-0-combo-sip-module-1t1r/

Overview:

Chipset : Broadcom
Form Factor: Stamp Type
Interface: WiFi : SDIO 3.0 / 2.0 ; BT: UART / PCM
Antenna: External
Support: Linux , Android

AP6256 is 11ac/a/b/g/n 1T1R WiFi +Bluetooth 5.0 SiP Module, 802.11ac allow efficient allocation of low data-rate connections, also it could interact with different vendors’ 802.11ac/a/b/g/n 1x1 Access Points with SISO standard and can accomplish up to speed of 433.3Mbps with dual stream. Furthermore AP6256 included SDIO interface for Wi-Fi, UART/ PCM interface for Bluetooth.

In addition, this compact module is a total solution for a combination of Wi-Fi + BT technologies. The module is specifically developed for tablet, OTT box and portable devices.

Standard
IEEE 802.11 ac/a/b/g/n 1T1R Wi-Fi + BT 5.0 Module Bluetooth V5.0 , GFSK、DQPSK、8DPSK、LE(1Mbps)、2LE(2Mbps)
Interface
WiFi Interface	SDIO 3.0 / 2.0
BT Interface	UART / PCM
Chipset
Broadcom
Radio
Antenna	External
Operating Frequency	2.400 GHz ~ 2.4835 GHz (2.4GHz ISM Band) 5.15~5.35GHz、5.47~5.725GHz、5.725~5.85GHz (5GHz UNII Band) Bluetooth: 2402 MHz ~ 2480 MHz
Modulation	802.11b : DQPSK、DBPSK、CCK 802.11 g/n : OFDM /64-QAM、16-QAM、QPSK、BPSK 802.11a : OFDM /64-QAM、16-QAM、QPSK、BPSK 802.11n : OFDM /64-QAM、16-QAM、QPSK、BPSK 802.11ac : OFDM /256-QAM、OFDM /64-QAM、16-QAM、QPSK、BPSK Bluetooth: GFSK、DQPSK、8DPSK、LE(1Mbps)、2LE(2Mbps)
Form Factor
Stamp Type
Environmental
Temperature Range	-30°C ~ 85°C (Operating) ; -40°C ~ 125°C (Storage)
Humidity (Non-Condensing)	Operating Humidity 10% to 95% Non-Condensing
Physical Specification
Dimensions	L x W: 12 x 12(Typ.)mm、H : 1.65 (Max.) mm (with shielding cover) L x W: 12 x 12(Typ.)mm、H : 1.37 (Max.) mm (without shielding cover)
Software
Driver	Linux, Android